Study of resistivity and emissivity of a film membrane for EUV lithography

Researchers present a method to develop an EUV film with better thermal stability that can withstand high-power EUV light sources.

New technical article from Hanyang University and the University of Texas at Dallas.

“A pellicle is a thin membrane structure that protects an extreme ultraviolet (EUV) mask from contamination during the exposure process. However, its limited transmission induces undesirable heating due to the absorption of EUV photons. Breakage of the EUV film can be prevented by improving its thermal stability, which is achieved by improving the emissivity of the film. However, emissivity data for thin films are not readily available in the literature and their value is very sensitive to thickness. Therefore, we investigated the dependence of emissivity on structural parameters, such as thickness, surface roughness, and grain size. We found a correlation between resistivity and emissivity using theoretical and experimental approaches. By changing the grain size of the Ru thin film, the relationship between resistivity and emissivity was experimentally verified and confirmed using the Lorentz-Drude model. Finally, we present a method to develop an EUV film with better thermal stability that can withstand high power EUV light sources.

Find Open Access data sheet link here.

Wi, SJ; Jang, YJ; Kim, H.; Cho, K.; Ahn, J. Investigation of resistivity and emissivity of a pellicle membrane for EUV lithography. Membranes 2022, 12, 367.

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